This is a multi-institutional interdisciplinary project held by The University of Hong Kong, The Hong Kong University of Science and Technology, and The Chinese University of Hong Kong, and is funded by the Areas of Excellence Scheme. The current project team comprises Professor Fu-Chun Zhang (Physics, HKU), Professor Philip Chan (EE, HKUST), Professor Guanhua Chen (Chemistry, HKU), Professor Weng-Cho Chew (EE, HKU), Professor Hong Guo (Physics, McGill Univ.), Professor Jian Wang (Physics, HKU), and several co-investigators.

           The project is to develop a suite of multi-scale electronic devices and circuit modeling tools ranging from atomistic simulation, circuit simulators, electromagnetic solvers, to lithography modeling, and to calculate the electric properties of emerging electronic devices and integrated circuits.

           The project is currently recruiting Post-doctoral Fellows and Research Assistant Professors to work on one of the following sub-projects:

• To simulate from first-principles the electrical properties and processes of sub-22nm devices with atomistic details
• To investigate lithography modeling, and to employ efficient electromagnetic solvers to simulate electrical signals, power delivery, crosstalk, interference, and noise in multi-scale complex integrated circuits
• To calculate and model the electrical, chemical and mechanical properties of new materials for sub-22nm technology
• To develop modeling tools for emerging spintronics
• To use electron beam lithography technology to fabricate the sub-22nm devices for measurement and calibration of the parameters in our EDA tools
• To develop a set of multi-scale EDA tools for emerging devices and integrated circuits