Abstract:
Modern simulation work in microelectronics is not only an issue of advanced theoretical foundations but also rather elementary equations become a true challenge if the problem scales into several thousands of devices. In particular, addressing electrical and thermal flows simultaneously in power architectures requires the simulation of thousands of devices and their interconnect design in a three-dimensional manner. In this presentation, a number of algorithm innovations is presented to cover electro-thermal simulation for power-management circuits. The algorithms concern meshing, node compression and compact model insertions at proper locations in the design flow.
Coffee and tea will be served 20 minutes prior to the seminar.